1217 search results - page 234 / 244 » Uncertainty-aware circuit optimization |
ICCAD
2009
IEEE
14 years 7 months ago
2009
IEEE
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
101
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CDC
2010
IEEE
14 years 4 months ago
2010
IEEE
In this work, we propose a distributed control strategy for perimeter patrolling and target tracking in a multi-camera videosurveillance system with communication, resources and sp...
DAC
2008
ACM
15 years 10 months ago
2008
ACM
Intrinsic and parasitic capacitances play an important role in determining the high?frequency RF performance of devices. Recently, a new type of carbon nanotube field effect trans...
DAC
2007
ACM
15 years 10 months ago
2007
ACM
The flip-chip package provides a high chip-density solution to the demand for more I/O pads of VLSI designs. In this paper, we present the first routing algorithm in the literatur...
DAC
2003
ACM
15 years 10 months ago
2003
ACM
Power dissipation is becoming the most challenging design constraint in nanometer technologies. Among various design implementation schemes, standard cell ASICs offer the best pow...