: Thermal issue is a critical challenge in 3D IC circuit design. Incorporating thermal vias into 3D IC is a promising way to mitigate thermal issues by lowering down the thermal re...
Due to the dramatic increase in design complexity, verifying the functional correctness of a circuit is becoming more difficult. Therefore, bugs may escape all verification effo...
Operating an integrated circuit at the prescribed nominal supply voltage is not preferable for reliable circuit operation under temperature fluctuations. A design methodology base...
Traditional circuit design focuses on optimizing the static critical paths no matter how infrequently these paths are exercised dynamically. Circuit optimization is then tuned to ...
In this paper we report the fully depleted CMOS/SOI device design guidelines for low power applications. Optimal technology, device and circuit parameters are discussed and compar...
Srinivasa R. Banna, Philip C. H. Chan, Mansun Chan...