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» Use of local biasing in designing analog integrated circuits
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ASPDAC
2007
ACM
164views Hardware» more  ASPDAC 2007»
13 years 10 months ago
Thermal-Aware 3D IC Placement Via Transformation
- 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...
Jason Cong, Guojie Luo, Jie Wei, Yan Zhang
GLVLSI
2010
IEEE
190views VLSI» more  GLVLSI 2010»
13 years 8 months ago
A linear statistical analysis for full-chip leakage power with spatial correlation
In this paper, we present an approved linear-time algorithm for statistical leakage analysis in the present of any spatial correlation condition (strong or weak). The new algorith...
Ruijing Shen, Sheldon X.-D. Tan, Jinjun Xiong