—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Mo...
Increased complexity of simulation models and the related modeling needs for global supply chains have necessitated the execution of simulations on multiple processors. While dist...
Background: The indexing of scientific literature and content is a relevant and contemporary requirement within life science information systems. Navigating information available ...
Christopher J. O. Baker, Kanagasabai Rajaraman, We...
The heterogeneity characterizing the systems populating the Ubiquitous Computing environment prevents their seamless interoperability. Heterogeneous protocols may be willing to coo...
The “JavaTM Intelligent Tutoring System” (JITS) research project involves the development of a programming tutor designed for students in their first programming course in Jav...