3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertic...
Mohamed M. Sabry, Ayse Kivilcim Coskun, David Atie...
Abstract. One of the main challenges for the successful application of agentbased systems in mobile and embedded devices is enabling application developers to reconcile the needs o...
The unrelenting pace of change that confronts contemporary software developers compels them to make their applications more configurable, flexible, and adaptive. In order to ach...
Ayla Dantas, Joseph W. Yoder, Paulo Borba, Ralph E...
We introduce the challenge problem for generic video indexing to gain insight in intermediate steps that affect performance of multimedia analysis methods, while at the same time...
Cees Snoek, Marcel Worring, Jan van Gemert, Jan-Ma...
An infrastructure for remote instrument access, data acquisition and data management is being developed for e-Research. The Common Instrument Middleware Architecture (CIMA) is bei...
Ian M. Atkinson, Douglas du Boulay, Clinton Chee, ...