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3DIC
2009
IEEE
184views Hardware» more  3DIC 2009»
15 years 10 months ago
Architectural evaluation of 3D stacked RRAM caches
The first memristor, originally theorized by Dr. Leon Chua in 1971, was identified by a team at HP Labs in 2008. This new fundamental circuit element is unique in that its resis...
Dean L. Lewis, HsienHsin S. Lee
GLOBECOM
2009
IEEE
15 years 10 months ago
QOMB: A Wireless Network Emulation Testbed
—In this paper we present QOMB, a testbed we designed and implemented for the evaluation of wireless network systems, protocols and applications. The testbed uses the wireless ne...
Razvan Beuran, Lan Tien Nguyen, Toshiyuki Miyachi,...
ICC
2009
IEEE
130views Communications» more  ICC 2009»
15 years 10 months ago
Flexible Single Sign-On for SIP: Bridging the Identity Chasm
—Identity federation is a key requirement for today’s distributed services. This technology allows managed sharing of users’ identity information between identity providers (...
Pin Nie, Juha-Matti Tapio, Sasu Tarkoma, Jani Heik...
IROS
2009
IEEE
198views Robotics» more  IROS 2009»
15 years 9 months ago
Scalable learning for object detection with GPU hardware
Abstract— We consider the problem of robotic object detection of such objects as mugs, cups, and staplers in indoor environments. While object detection has made significant pro...
Adam Coates, Paul Baumstarck, Quoc V. Le, Andrew Y...
MICRO
2009
IEEE
207views Hardware» more  MICRO 2009»
15 years 9 months ago
Extending the effectiveness of 3D-stacked DRAM caches with an adaptive multi-queue policy
3D-integration is a promising technology to help combat the “Memory Wall” in future multi-core processors. Past work has considered using 3D-stacked DRAM as a large last-level...
Gabriel H. Loh