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156
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ICCD
2002
IEEE
16 years 2 months ago
2002
IEEE
With technology advancing toward deep submicron, leakage energy is of increasing concern, especially for large onchip array structures such as caches and branch predictors. Recent...
150
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ICCAD
2008
IEEE
16 years 2 months ago
2008
IEEE
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
165
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FPGA
2010
ACM
16 years 2 months ago
2010
ACM
Deep submicron processes have allowed FPGAs to grow in complexity and speed. However, such technology scaling has caused FPGAs to become more susceptible to the effects of process...
172
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TEI
2010
ACM
16 years 24 days ago
2010
ACM
Children with hemiplegic cerebral palsy often lack the physical skills to explore their environment independently, express feelings, communicate, and successfully participate in s...
161
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SC
2009
ACM
16 years 23 days ago
2009
ACM
Continuous evolution in process technology brings energyefficiency and reliability challenges, which are harder for memory system designs since chip multiprocessors demand high ba...