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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
15 years 8 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
HPDC
2008
IEEE
15 years 6 months ago
Improving peer connectivity in wide-area overlays of virtual workstations
Self-configuring virtual networks rely on structured P2P routing to provide seamless connectivity among nodes through overlay routing of virtual IP packets, support decentralized...
Arijit Ganguly, P. Oscar Boykin, David Wolinsky, R...
DSN
2004
IEEE
15 years 3 months ago
Fault Tolerant Energy Aware Data Dissemination Protocol in Sensor Networks
In this paper we present a data dissemination protocol for efficiently distributing data through a sensor network in the face of node and link failures. Our work is motivated by t...
Gunjan Khanna, Saurabh Bagchi, Yu-Sung Wu
RAS
2007
132views more  RAS 2007»
14 years 11 months ago
Virtual sensors for human concepts - Building detection by an outdoor mobile robot
Abstract— In human-robot communication it is often important to relate robot sensor readings to concepts used by humans. We suggest to use a virtual sensor (one or several physic...
Martin Persson, Tom Duckett, Achim J. Lilienthal
CAMAD
2006
IEEE
15 years 3 months ago
On the exploitation of user aggregation strategies in heterogeneous wireless networks
Abstract-- In this paper we discuss the exploitation of aggregated mobility patterns and physical proximity of nodes in a so-called ambient network, i.e., a wireless network with h...
Leonardo Badia, Nicola Bui, Marco Miozzo, Michele ...