2449 search results - page 397 / 490 » VLSI |
116
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ICCAD
2008
IEEE
16 years 1 months ago
2008
IEEE
—To overcome the energy-efficiency limitations imposed by finite sub-threshold slope in CMOS transistors, this paper explores the design of integrated circuits based on nanoelect...
130
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ICCAD
2008
IEEE
16 years 1 months ago
2008
IEEE
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
101
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ICCAD
2007
IEEE
16 years 1 months ago
2007
IEEE
—In the VLSI design process, a design implementation often needs to be corrected because of new specifications or design constraint violations. This correction process is referre...
134
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ICCAD
2007
IEEE
16 years 1 months ago
2007
IEEE
While the increasing need for addressing process variability in sub-90nm VLSI technologies has sparkled a large body of statistical timing and optimization research, the realizati...
121
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ICCAD
2006
IEEE
16 years 1 months ago
2006
IEEE
In this paper, we propose the first wire density driven global routing that considers CMP variation and timing. To enable CMP awareness during global routing, we propose a compac...