Fault prediction models still seem to be more popular in academia than in industry. In industry expert estimations of fault proneness are the most popular methods of deciding wher...
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
The impact of process variation in state of the art technology makes traditional (worst case) designs unnecessarily pessimistic, which translates to suboptimal designs in terms of...
A nalog circuit implementations of fuzzy logic are characterized by performing logical connectives of analog signals. They can be considered as generalization of digital circuits ...
The concept of interoperability of data and model as presented in this paper is viewed as being very useful for implementing variety of future applications related to power system...
Mladen Kezunovic, Santiago Grijalva, Papiya Dutta,...