499 search results - page 35 / 100 » Wire shaping is practical |
103
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ECIS
2000
15 years 1 months ago
2000
- E-services will change the future of business as well as private relationships. The rearrangement of value chains, new competitive arenas and the growing necessity and interest i...
FPGA
2003
ACM
15 years 5 months ago
2003
ACM
How does multilevel metalization impact the design of FPGA interconnect? The availability of a growing number of metal layers presents the opportunity to use wiring in the thirddi...
130
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ISPD
2012
ACM
13 years 7 months ago
2012
ACM
In this paper, we propose a new approach for gated bus synthesis [16] with minimum wire capacitance per transaction in three-dimensional (3D) ICs. The 3D IC technology connects di...
ICCAD
2005
IEEE
15 years 8 months ago
2005
IEEE
The work in this paper analyses the applicability of carbon nanotube (CNT) bundles as interconnects for VLSI circuits, while taking into account the practical limitations in this ...
ITNG
2006
IEEE
15 years 5 months ago
2006
IEEE
—In this paper, we address the scheduling problem for Clos-network switches with no buffers at the central stage. Existing scheduling (dispatching) algorithms for this type of sw...