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ICCAD
2002
IEEE
73views Hardware» more  ICCAD 2002»
14 years 3 months ago
Shaping interconnect for uniform current density
As the VLSI technology scaling down, the electromigration problem becomes one of the major concerns in high-performance IC design for both power network and signal interconnects. ...
Muzhou Shao, D. F. Wong, Youxin Gao, Li-Pen Yuan, ...
INTEGRATION
2007
95views more  INTEGRATION 2007»
13 years 6 months ago
Wire shaping of RLC interconnects
The optimum wire shape to produce the minimum signal propagation delay across an RLC line is shown to exhibit a general exponential form. The line inductance makes exponential tap...
Magdy A. El-Moursy, Eby G. Friedman
VLSISP
2008
108views more  VLSISP 2008»
13 years 6 months ago
Interconnect Driver Design for Long Wires in Field-Programmable Gate Arrays
Each new semiconductor technology node brings smaller, faster transistors and smaller, slower wires. In particular, long interconnect wires in modern FPGAs now require rebuffering ...
Edmund Lee, Guy Lemieux, Shahriar Mirabbasi
ISQED
2002
IEEE
126views Hardware» more  ISQED 2002»
13 years 11 months ago
Formulae for Performance Optimization and Their Applications to Interconnect-Driven Floorplanning
As the process technology advances into the deep submicron era, interconnect plays a dominant role in determining circuit performance. Buffer insertion/sizing and wire sizing are ...
Nicholas Chia-Yuan Chang, Yao-Wen Chang, Iris Hui-...
TVLSI
2008
78views more  TVLSI 2008»
13 years 6 months ago
Minimal-Power, Delay-Balanced Smart Repeaters for Global Interconnects in the Nanometer Regime
Abstract--A SMART repeater is proposed for driving capacitively-coupled, global-length on-chip interconnects that alters its drive strength dynamically to match the relative bit pa...
Roshan Weerasekera, Dinesh Pamunuwa, Li-Rong Zheng...