2 search results - page 1 / 1 » Yield prediction for 3D capacitive interconnections |
94
Voted
ICCAD
2006
IEEE
15 years 10 months ago
2006
IEEE
Capacitive interconnections are very promising structures for high-speed and low-power signaling in 3D packages. Since the performance of AC links, in terms of Band-Width and Bit-...
106
Voted
DATE
2010
IEEE
15 years 7 months ago
2010
IEEE
—3D integration is a key solution to the predicted performance increase of future electronic systems. It offers extreme miniaturization and fabrication of More than Moore product...