Boolean satisfiability (SAT) based methods have traditionally been popular for formally verifying properties for digital circuits. We present a novel methodology for formulating a...
Saurabh K. Tiwary, Anubhav Gupta, Joel R. Phillips...
The flip-chip package is introduced for modern IC designs with higher integration density and larger I/O counts. In this paper, we consider the pre-assignment flip-chip routing pr...
While Dynamic Voltage Scaling (DVS) remains as a popular energy management technique for real-time embedded applications, recent research has identified significant and negative i...
Pre-bond testing of 3D stacked ICs involves testing individual dies before bonding. The overall yield of 3D ICs improves with prebond testability because designers can avoid stack...
Xin Zhao, Dean L. Lewis, Hsien-Hsin S. Lee, Sung K...
A parallel computing approach for large-scale SPICE-accurate circuit simulation is described that is based on a new preconditioned iterative solver. The preconditioner involves the...
Heidi Thornquist, Eric R. Keiter, Robert J. Hoekst...