Abstract-- Process scaling and higher leakage power have resulted in increased power densities and elevated die temperatures. Due to the interdependence of temperature and leakage ...
Aseem Gupta, Nikil D. Dutt, Fadi J. Kurdahi, Kamal...
- This paper presents a novel architectural mechanism and a power management structure for the design of an energy-efficient Gigabit Ethernet controller. Key characteristics of suc...
Parallel prefix adder is the most flexible and widely-used binary adder for ASIC designs. Many high-level synthesis techniques have been developed to find optimal prefix structures...
Jianhua Liu, Yi Zhu, Haikun Zhu, Chung-Kuan Cheng,...
Abstract-- This paper describes the stochastic model order reduction algorithm via stochastic Hermite Polynomials from the practical implementation perspective. Comparing with exis...
Yi Zou, Yici Cai, Qiang Zhou, Xianlong Hong, Sheld...
- For sub-90nm technology nodes and below, random fluctuations of within-die physical process properties are also known as random on-chip variation (OCV). It impacts on the VLSI/So...
Jun-Fu Huang, Victor C. Y. Chang, Sally Liu, Kelvi...