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CODES
2007
IEEE
15 years 10 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
CODES
2007
IEEE
15 years 8 months ago
Energy efficient co-scheduling in dynamically reconfigurable systems
Energy consumption is a major issue in dynamically reconfigurable systems because of the high power requirements during repeated configurations. Hardware designs employ low power ...
Pao-Ann Hsiung, Pin-Hsien Lu, Chih-Wen Liu
CODES
2007
IEEE
15 years 10 months ago
Reliable multiprocessor system-on-chip synthesis
This article presents a multiprocessor system-on-chip synthesis (MPSoC) algorithm that optimizes system mean time to failure. Given a set of directed acyclic periodic graphs of co...
Changyun Zhu, Zhenyu (Peter) Gu, Robert P. Dick, L...
CODES
2007
IEEE
15 years 10 months ago
Power deregulation: eliminating off-chip voltage regulation circuitry from embedded systems
In battery-powered embedded systems, dedicated circuitry is used to convert stored energy into a form that can be directly used by processors. These power regulation devices seek ...
Seunghoon Kim, Robert P. Dick, Russ Joseph
CODES
2007
IEEE
15 years 10 months ago
HW/SW co-design for Esterel processing
We present a co-synthesis approach that accelerates reactive software processing by moving the calculation of complex expressions into external combinational hardware. The startin...
Sascha Gädtke, Claus Traulsen, Reinhard von H...