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2010
IEEE
162views Hardware» more  DATE 2010»
15 years 9 months ago
Error resilience of intra-die and inter-die communication with 3D spidergon STNoC
: Scaling down in very deep submicron (VDSM) technologies increases the delay, power consumption of on-chip interconnects, while the reliability and yield decrease. In high perform...
Vladimir Pasca, Lorena Anghel, Claudia Rusu, Ricca...
ISCA
2010
IEEE
189views Hardware» more  ISCA 2010»
15 years 9 months ago
RETCON: transactional repair without replay
Over the past decade there has been a surge of academic and industrial interest in optimistic concurrency, i.e. the speculative parallel execution of code regions that have the se...
Colin Blundell, Arun Raghavan, Milo M. K. Martin
ITNG
2010
IEEE
15 years 9 months ago
Middleware Specialization for Product-Lines Using Feature-Oriented Reverse Engineering
Supporting the varied software feature requirements of multiple variants of a software product-line while promoting reuse forces product line engineers to use general-purpose, fea...
Akshay Dabholkar, Aniruddha S. Gokhale
CF
2010
ACM
15 years 9 months ago
ERBIUM: a deterministic, concurrent intermediate representation for portable and scalable performance
Tuning applications for multi-core systems involve subtle concepts and target-dependent optimizations. New languages are being designed to express concurrency and locality without...
Cupertino Miranda, Philippe Dumont, Albert Cohen, ...
PLDI
2010
ACM
15 years 9 months ago
Bamboo: a data-centric, object-oriented approach to many-core software
Traditional data-oriented programming languages such as dataflow s and stream languages provide a natural abstraction for parallel programming. In these languages, a developer fo...
Jin Zhou, Brian Demsky