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143
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ICCD
2004
IEEE
16 years 1 months ago
2004
IEEE
This short paper explores an implementation of a new technology called 3D die stacking and describes research activity at Intel. 3D die stacking is the bonding of two die either f...
143
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ICCD
2004
IEEE
16 years 1 months ago
2004
IEEE
Networks-on-Chip (NoC), a new SoC paradigm, has been proposed as a solution to mitigate complex on-chip interconnect problems. NoC architecture consists of a collection of IP core...
102
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ICCAD
2004
IEEE
16 years 1 months ago
2004
IEEE
With the increase of design complexities and the decrease of minimal feature sizes, IP reuse is becoming a common practice while crosstalk is becoming a critical issue that must b...
126
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ICCAD
2004
IEEE
16 years 1 months ago
2004
IEEE
Improving logic capacity by time-sharing, dynamically reconfigurable FPGAs are employed to handle designs of high complexity and functionality. In this paper, we model each task ...
153
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IDTRUST
2009
ACM
15 years 11 months ago
2009
ACM
Organizations owning cyber-infrastructure assets face large scale distributed attacks on a regular basis. In the face of increasing complexity and frequency of such attacks, we ar...