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190
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ICCV
2011
IEEE
14 years 6 months ago
2011
IEEE
We present a method for detecting 3D objects using multi-modalities. While it is generic, we demonstrate it on the combination of an image and a dense depth map which give complem...
170
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ICCV
2011
IEEE
14 years 6 months ago
2011
IEEE
In this paper, we introduce a novel method for depth acquisition based on refraction of light. A scene is captured twice by a fixed perspective camera, with the first image capt...
183
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DAC
2011
ACM
14 years 6 months ago
2011
ACM
This paper presents a simulation toolset for estimating the impact of Trusted Platform Modules (TPMs) on the performance of applications that use TPM services, especially in multi...
177
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DAC
2011
ACM
14 years 6 months ago
2011
ACM
This paper studies TSV-to-TSV coupling in 3D ICs. A full-chip SI analysis flow is proposed based on the proposed coupling model. Analysis results show that TSVs cause significan...
150
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ICASSP
2011
IEEE
14 years 10 months ago
2011
IEEE
In this paper, we address the problem of the sensor placement for estimating the direction of a narrow-band source, randomly located in the far-field of a planar antenna array. E...