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117
Voted
DAC
2007
ACM
16 years 4 months ago
2007
ACM
The flip-chip package provides a high chip-density solution to the demand for more I/O pads of VLSI designs. In this paper, we present the first routing algorithm in the literatur...
131
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DAC
2007
ACM
16 years 4 months ago
2007
ACM
Negative bias temperature instability (NBTI) in MOSFETs is one of the major reliability challenges in nano-scale technology. This paper presents an efficient technique to characte...
111
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DAC
2007
ACM
16 years 4 months ago
2007
ACM
In this paper, we present a new multi-packing tree (MP-tree) representation for macro placement to handle mixed-size designs. Based on binary trees, the MP-tree is very efficient,...
112
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DAC
2007
ACM
16 years 4 months ago
2007
ACM
With increasing time-to-market pressure and shortening semiconductor product cycles, more and more chips are being designed with library-based methodologies. In spite of this shif...
127
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ICML
2009
IEEE
16 years 4 months ago
2009
IEEE
The promise of unsupervised learning methods lies in their potential to use vast amounts of unlabeled data to learn complex, highly nonlinear models with millions of free paramete...