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ICCD
2005
IEEE
15 years 8 months ago
2005
IEEE
Designing temperature-aware microarchitectures for microprocessors at new technologies is becoming a critical requirement due to the exponentially increasing on-chip power density...
ICCAD
2005
IEEE
15 years 8 months ago
2005
IEEE
— One of the critical goals in code optimization for MPSoC architectures is to minimize the number of off-chip memory accesses. This is because such accesses can be extremely cos...
ICCAD
2005
IEEE
15 years 8 months ago
2005
IEEE
— The flip-chip package gives the highest chip density of any packaging method to support the pad-limited Application-Specific Integrated Circuit (ASIC) designs. In this paper,...
ICCAD
2005
IEEE
15 years 8 months ago
2005
IEEE
Placement migration is a critical step to address a variety of postplacement design closure issues, such as timing, routing congestion, signal integrity, and heat distribution. To...
ICCAD
2005
IEEE
15 years 8 months ago
2005
IEEE
Networks-on-Chip (NoCs) represent a promising solution to complex on-chip communication problems. The NoC communication architectures considered so far are based on either complete...