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DAC
2010
ACM
14 years 8 months ago
2010
ACM
A three-dimensional (3D) CMOS imager constructed by stacking a pixel array of backside illuminated sensors, an analog-to-digital converter (ADC) array, and an image signal process...
129
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DAC
2010
ACM
14 years 8 months ago
2010
ACM
This paper presents Xetal-Pro SIMD processor, which is based on Xetal-II, one of the most computational-efficient (in terms of GOPS/Watt) processors available today. XetalPro supp...
DAC
2010
ACM
14 years 8 months ago
2010
ACM
Numerous algorithms to macromodel a linear time-invariant (LTI) system from its frequency-domain sampling data have been proposed in recent years [1, 2, 3, 4, 5, 6, 7, 8], among w...
DAC
2010
ACM
14 years 8 months ago
2010
ACM
The verification of large radio-frequency/millimeter-wave (RF/MM) integrated circuits (ICs) has regained attention for high-performance designs beyond 90nm and 60GHz. The traditio...
DPD
2002
14 years 10 months ago
2002
The current standard in governing distributed transaction termination is the so-called Two-Phase Commit protocol (2PC). The first phase of 2PC is a voting phase, where the partici...