Inductive cross-talk within IC packaging is becoming a significant bottleneck in high-speed inter-chip communication. The parasitic inductance within IC packaging causes bounce o...
One of the greatest impediments to achieving high quality placements using force-directed methods lies in the large amount of overlap initially present in these techniques. This o...
This paper proposes a diagnosis scheme aimed at reducing diagnosis time of distributed small embedded SRAMs (e-SRAMs). This scheme improves the one proposed in [7, 8]. The improve...
A comprehensive probabilistic methodology is proposed to solve the buffer insertion problem with the consideration of process variations. In contrast to a recent work, we point o...
— Sharing IP blocks in today’s competitive market poses significant high security risks. Creators and owners of IP designs want assurances that their content will not be illeg...