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DATE
2007
IEEE
15 years 4 months ago
2007
IEEE
Embedded First-In First-Out (FIFO) memories are increasingly used in many IC designs. We have created a new full-custom embedded FIFO module with asynchronous read and write clock...
DATE
2007
IEEE
15 years 4 months ago
2007
IEEE
In deep submicron circuits, elevation in temperatures has brought new challenges in reliability, timing, performance, cooling costs and leakage power. Conventional thermal managem...
DATE
2007
IEEE
15 years 4 months ago
2007
IEEE
We present a methodology for generating optimized architectures for data bandwidth constrained extensible processors. We describe a scalable Integer Linear Programming (ILP) formu...
DATE
2007
IEEE
15 years 4 months ago
2007
IEEE
Partial reconfiguration allows parts of the reconfigurable chip area to be configured without affecting the rest of the chip. This allows placement of tasks at run time on the rec...
DATE
2007
IEEE
15 years 4 months ago
2007
IEEE
Double-via placement is important for increasing chip manufacturing yield. Commercial tools and recent work have done a great job for it. However, they are found with a limited ca...