438 search results - page 52 / 88 » date 2009 |
135
click to vote
DATE
2009
IEEE
16 years 6 days ago
2009
IEEE
— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
148
click to vote
DATE
2009
IEEE
16 years 6 days ago
2009
IEEE
Abstract—In this paper a programmable Forward Error Correction (FEC) IP for a DVB-S2 receiver is presented. It is composed of a Low-Density Parity Check (LDPC), a Bose-ChaudhuriH...
146
click to vote
DATE
2009
IEEE
16 years 6 days ago
2009
IEEE
—Interconnect structures significantly contribute to the delay, power consumption, and silicon area of modern reconfigurable architectures. The demand for higher clock frequencie...
140
click to vote
DATE
2009
IEEE
16 years 6 days ago
2009
IEEE
Abstract—High computational effort in modern image processing applications like medical imaging or high-resolution video processing often demands for massively parallel special p...
142
click to vote
DATE
2009
IEEE
16 years 6 days ago
2009
IEEE
Abstract—Supply voltage fluctuations that result from inductive noise are increasingly troublesome in modern microprocessors. A voltage “emergency”, i.e., a swing beyond tol...