—In a conventional SoC designs, on-chip memories occupy more than the 50% of the total die area. 3D technology enables the distribution of logic and memories on separate stacked ...
Marco Facchini, Paul Marchal, Francky Catthoor, Wi...
— The use of dynamic voltage and frequency scaling (DVFS) in contemporary multicores provides significant protection from unpredictable thermal events. A side effect of DVFS can ...
Ramakrishna Vadlamani, Jia Zhao, Wayne P. Burleson...
—Recent developments have shown the possibility of leveraging silicon nanophotonic technologies for chip-scale interconnection fabrics that deliver high bandwidth and power effi...
Johnnie Chan, Gilbert Hendry, Aleksandr Biberman, ...
Abstract—Future microprocessors increasingly rely on an unreliable CMOS fabric due to aggressive scaling of voltage and frequency, and shrinking design margins. Fortunately, many...
Sriram Narayanan, John Sartori, Rakesh Kumar, Doug...
—The success of server virtualization has let to the deployment of a huge number of virtual machines in today’s data centers, making a manual virtualization management very lab...
Matthias Bolte, Michael Sievers, Georg Birkenheuer...