—3D integration is a key solution to the predicted performance increase of future electronic systems. It offers extreme miniaturization and fabrication of More than Moore product...
—As Electronic Control Units (ECUs) and embedded software functions within an automobile keep increasing in number, the scale and complexity of automotive embedded systems is gro...
A new delay-insensitive data encoding scheme for global asynchronous communication is introduced. The goal of this work is to combine the timing-robustness of delay-insensitive (i....
—Multi-Processor System-on-Chips (MPSoCs) exploit task-level parallelism to achieve high computation throughput, but concurrent memory accesses from multiple PEs may cause memory...
There is a growing concern about the increasing vulnerability of future computing systems to errors in the underlying hardware. Traditional redundancy techniques are expensive for...
Larkhoon Leem, Hyungmin Cho, Jason Bau, Quinn A. J...