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fteda 2008
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FTEDA 2008
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Thermally Aware Design
15 years 3 months ago
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www.ece.umn.edu
With greater integration, the power dissipation in integrated circuits has begun to outpace the ability of today's heat sinks to limit the on-chip temperature. As a result, t...
Yong Zhan, Sanjay V. Kumar, Sachin S. Sapatnekar
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