Sciweavers

26 search results - page 1 / 6
» ics 2011
Sort
View
ECCTD
2011
68views more  ECCTD 2011»
12 years 6 months ago
An ontology for constraints in custom IC design
Abstract—The design of integrated circuits involves the consideration of a large number of constraints of various types. In addition to the definition of these constraints in a ...
Andreas Krinke, Jens Lienig
DAC
2011
ACM
12 years 6 months ago
Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC
This paper studies TSV-to-TSV coupling in 3D ICs. A full-chip SI analysis flow is proposed based on the proposed coupling model. Analysis results show that TSVs cause significan...
Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, ...
ICASSP
2011
IEEE
12 years 10 months ago
Interference self-mitigating beamforming for the K-user MIMO IC
This work studies distributed linear transmission strategies for the multiple-input multiple-output (MIMO) interference channel with multiple concurrent links. We introduce the no...
Jianqi Wang, Amitav Mukherjee, A. Lee Swindlehurst
DAC
2011
ACM
12 years 6 months ago
TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC
In this work, we propose an efficient and accurate full-chip thermomechanical stress and reliability analysis tool and design optimization methodology to alleviate mechanical rel...
Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Ky...
TCAD
2011
13 years 1 months ago
Low-Power Clock Tree Design for Pre-Bond Testing of 3-D Stacked ICs
—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...
Xin Zhao, Dean L. Lewis, Hsien-Hsin S. Lee, Sung K...