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DAC
2011
ACM
12 years 7 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
SYNTHESE
2011
98views more  SYNTHESE 2011»
13 years 2 months ago
How scientific models can explain
: ic models invariably involve some degree of idealization, abstraction, or fictionalization of their target system. Nonetheless, I argue that there are circumstances under which s...
Alisa Bokulich
EOR
2011
172views more  EOR 2011»
13 years 2 months ago
Efficiency measurement using independent component analysis and data envelopment analysis
Efficiency measurement is an important issue for any firm or organization. Efficiency measurement allows organizations to compare their performance with their competitors’ and t...
Ling-Jing Kao, Chi-Jie Lu, Chih-Chou Chiu
CCECE
2011
IEEE
12 years 7 months ago
Resistively and capacitively shunted Josephson junctions model for unconventional superconductors
—An array of resistively and capacitively shunted Josephson junctions with nonsinusoidal currentphase relation is considered for modelling the resistive transition in high-Tc sup...
Linda Ponta, Anna Carbone, Marco Gilli, Piero Mazz...
ICS
2011
Tsinghua U.
12 years 10 months ago
Predictive coordination of multiple on-chip resources for chip multiprocessors
Efficient on-chip resource management is crucial for Chip Multiprocessors (CMP) to achieve high resource utilization and enforce system-level performance objectives. Existing mul...
Jian Chen, Lizy Kurian John