Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
: ic models invariably involve some degree of idealization, abstraction, or fictionalization of their target system. Nonetheless, I argue that there are circumstances under which s...
Efficiency measurement is an important issue for any firm or organization. Efficiency measurement allows organizations to compare their performance with their competitors’ and t...
—An array of resistively and capacitively shunted Josephson junctions with nonsinusoidal currentphase relation is considered for modelling the resistive transition in high-Tc sup...
Linda Ponta, Anna Carbone, Marco Gilli, Piero Mazz...
Efficient on-chip resource management is crucial for Chip Multiprocessors (CMP) to achieve high resource utilization and enforce system-level performance objectives. Existing mul...