3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertic...
Mohamed M. Sabry, Ayse Kivilcim Coskun, David Atie...
With aggressive technology scaling, integrated circuits suffer from everincreasing wearout effects and their lifetime reliability has become a serious concern for the industry. Fo...
Building applications over Linked Data often requires a mapping between the application model and the ontology underlying the source dataset in the Linked Data cloud. This mapping ...
This article proposes a research agenda aimed at enabling optimized testing and analysis processes and tools to support component-based software development communities. We hypoth...
Packet assembly at the network edge is one solution to reduce high packet rates in core network switches. Literature discusses this topic controversially because of three reasons: ...
Arthur Mutter, Sebastian Gunreben, Wolfram Lautens...