1824 search results - page 267 / 365 » interfaces 2006 |
134
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MICRO
2006
IEEE
15 years 11 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
147
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WECWIS
2006
IEEE
15 years 11 months ago
2006
IEEE
UN/CEFACT’s modeling methodology (UMM) is used to develop global choreographies of inter-organizational business processes. UMM models should be publically available in order to...
152
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APGV
2006
ACM
15 years 11 months ago
2006
ACM
Previous research has found performance for several egocentric tasks to be superior on physically large displays relative to smaller ones, even when visual angle is held constant....
153
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CSCW
2006
ACM
15 years 11 months ago
2006
ACM
This paper presents a grounded theory of information sharing behavior of the users of a personal learning space. A personal learning space is an environment consisted of weblog, e...
145
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HASKELL
2006
ACM
15 years 11 months ago
2006
ACM
Modern functional languages offer several attractive features to support development of reliable and secure software. However, in our efforts to use Haskell for systems programmin...