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172
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ISQED
2002
IEEE
15 years 10 months ago
2002
IEEE
This paper presents a fast algorithm to optimize both the widths and lengths of power/ground networks under reliability and power dip/ground bounce constraints. The spacesizing wh...
138
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ISQED
2002
IEEE
15 years 10 months ago
2002
IEEE
In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit ar...
156
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ISQED
2002
IEEE
15 years 10 months ago
2002
IEEE
As the process technology advances into the deep submicron era, interconnect plays a dominant role in determining circuit performance. Buffer insertion/sizing and wire sizing are ...
162
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ISQED
2002
IEEE
15 years 10 months ago
2002
IEEE
With advancing semiconductor technology and exponentially growing design complexities, predictability of design tools becomes an important part of a stable top-down design process...