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MICRO
2008
IEEE
159views Hardware» more  MICRO 2008»
15 years 8 months ago
Copy or Discard execution model for speculative parallelization on multicores
The advent of multicores presents a promising opportunity for speeding up sequential programs via profile-based speculative parallelization of these programs. In this paper we pr...
Chen Tian, Min Feng, Vijay Nagarajan, Rajiv Gupta
97
Voted
MICRO
2008
IEEE
106views Hardware» more  MICRO 2008»
15 years 8 months ago
EVAL: Utilizing processors with variation-induced timing errors
Parameter variation in integrated circuits causes sections of a chip to be slower than others. If, to prevent any resulting timing errors, we design processors for worst-case para...
Smruti R. Sarangi, Brian Greskamp, Abhishek Tiwari...
ISCAS
2008
IEEE
118views Hardware» more  ISCAS 2008»
15 years 8 months ago
Low-power IC design for a wireless BCI system
—Integrated circuit (IC) design for a wireless BCI system is put forward in this paper. The system is composed of an electrode, a stimulator, antennas, and an integrated circuit ...
Ming Liu, Hong Chen, Run Chen, Zhihua Wang
CORR
2008
Springer
96views Education» more  CORR 2008»
15 years 1 months ago
High Efficiency 3-Phase Cmos Rectifier with Step Up and Regulated
: This paper presents several design issues related to the monolithic integration of a 3-phase AC to DC low voltage, low power rectifier for 3-phase micro source electrical conditi...
J.-C. Crebier, Y. Lembeye, H. Raisigel, O. Deleage...
104
Voted
CORR
2008
Springer
84views Education» more  CORR 2008»
15 years 1 months ago
Novel Bonding technologies for wafer-level transparent packaging of MOEMS
Packaging costs of Micro-Electro-Mechanical System (MEMS) are still contributing with >50% to the total costs of most devices. Aligned wafer bonding techniques for Wafer-level ...
Herwig Kirchberger, Paul Lindler, Markus Wimplinge...