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MICRO
2008
IEEE
159views Hardware» more  MICRO 2008»
15 years 3 months ago
Copy or Discard execution model for speculative parallelization on multicores
The advent of multicores presents a promising opportunity for speeding up sequential programs via profile-based speculative parallelization of these programs. In this paper we pr...
Chen Tian, Min Feng, Vijay Nagarajan, Rajiv Gupta
MICRO
2008
IEEE
106views Hardware» more  MICRO 2008»
15 years 3 months ago
EVAL: Utilizing processors with variation-induced timing errors
Parameter variation in integrated circuits causes sections of a chip to be slower than others. If, to prevent any resulting timing errors, we design processors for worst-case para...
Smruti R. Sarangi, Brian Greskamp, Abhishek Tiwari...
ISCAS
2008
IEEE
118views Hardware» more  ISCAS 2008»
15 years 3 months ago
Low-power IC design for a wireless BCI system
—Integrated circuit (IC) design for a wireless BCI system is put forward in this paper. The system is composed of an electrode, a stimulator, antennas, and an integrated circuit ...
Ming Liu, Hong Chen, Run Chen, Zhihua Wang
CORR
2008
Springer
96views Education» more  CORR 2008»
14 years 9 months ago
High Efficiency 3-Phase Cmos Rectifier with Step Up and Regulated
: This paper presents several design issues related to the monolithic integration of a 3-phase AC to DC low voltage, low power rectifier for 3-phase micro source electrical conditi...
J.-C. Crebier, Y. Lembeye, H. Raisigel, O. Deleage...
CORR
2008
Springer
84views Education» more  CORR 2008»
14 years 9 months ago
Novel Bonding technologies for wafer-level transparent packaging of MOEMS
Packaging costs of Micro-Electro-Mechanical System (MEMS) are still contributing with >50% to the total costs of most devices. Aligned wafer bonding techniques for Wafer-level ...
Herwig Kirchberger, Paul Lindler, Markus Wimplinge...