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MR
2007
127views Robotics» more  MR 2007»
14 years 10 months ago
A comprehensive model for PMOS NBTI degradation: Recent progress
Muhammad Ashraful Alam, Haldun Kufluoglu, D. Vargh...
MR
2007
102views Robotics» more  MR 2007»
14 years 10 months ago
Electrical measurements of voltage stressed Al2O3/GaAs MOSFET
Z. Tang, P. D. Ye, D. Lee, C. R. Wie
MR
2007
93views Robotics» more  MR 2007»
14 years 10 months ago
Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
The development of a simplified analytical model to describe the thermal history of a Printed Circuit Board assembly (PCA) during convective reflow soldering is described in this ...
Nele Van Steenberge, Paresh Limaye, Geert Willems,...
MR
2007
107views Robotics» more  MR 2007»
14 years 10 months ago
Cohesive zone modeling for structural integrity analysis of IC interconnects
Due to the miniaturization of integrated circuits, their thermo-mechanical reliability tends to become a truly critical design criterion.
B. A. E. van Hal, R. H. J. Peerlings, M. G. D. Gee...
MR
2007
83views Robotics» more  MR 2007»
14 years 10 months ago
Active ESD protection circuit design against charged-device-model ESD event in CMOS integrated circuits
CDM ESD event has become the main ESD reliability concern for integrated-circuits products using nanoscale CMOS technology. A novel CDM ESD protection design, using self-biased cu...
Shih-Hung Chen, Ming-Dou Ker