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TCAD
2008
14 years 10 months ago
2008
Abstract--Thermal issues are fast becoming major design constraints in high-performance systems. Temperature variations adversely affect system reliability and prompt worst-case de...
TCAD
2008
14 years 10 months ago
2008
We present in this paper a new interconnect-driven multilevel floorplanner, called interconnect-driven multilevelfloorplanning framework (IMF), to handle large-scale buildingmodule...
TCAD
2008
14 years 10 months ago
2008
In this paper, we present a new multipacking-tree (MP-tree) representation for macro placements to handle modern mixed-size designs with large macros and high chip utilization rate...
101
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TCAD
2008
14 years 10 months ago
2008
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
TCAD
2008
14 years 10 months ago
2008
New fusion memory devices consisting of multiple heterogeneous memory components in a single die or package offer efficient ways to optimize embedded systems in terms of energy, pe...