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ESAW
2009
Springer
14 years 8 months ago
2009
Springer
009), which constitutes an abstraction of the various aspects of a MAS, generalizing the AGR approach and incorporating the institutional work of Searle (Searle 1995). This model i...
SOUPS
2009
ACM
15 years 5 months ago
2009
ACM
: © Not One Click for Security Alan H. Karp, Marc Stiegler, Tyler Close HP Laboratories HPL-2009-53 Secure cooperation, usable security Conventional wisdom holds that security mus...
DATE
2009
IEEE
15 years 5 months ago
2009
IEEE
Abstract—This paper presents an accurate interconnect thermal model for analyzing the temperature distribution of an on-chip interconnect wire. The model addresses the ambient te...
130
Voted
CVPR
2009
IEEE
16 years 6 months ago
2009
IEEE
Different materials reflect light in different ways, and reflectance
interacts with shape, lighting, and viewpoint to
determine an object’s image. Common materials exhibit dive...
69
Voted
DAC
2009
ACM
16 years 1 days ago
2009
ACM
Semiconductor design companies are in a continuous search for design tools that address the ever increasing chip design complexity coupled with strict time-to-market schedules and...