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DAC
2011
ACM
14 years 3 months ago
2011
ACM
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
194
Voted
BMCBI
2011
14 years 10 months ago
2011
Background: Genomic position (GP) files currently used in next-generation sequencing (NGS) studies are always difficult to manipulate due to their huge size and the lack of approp...
216
Voted
ISPD
2011
ACM
14 years 6 months ago
2011
ACM
Three-dimensional ICs promise to significantly extend the scale of system integration and facilitate new-generation electronics. However, progress in commercial 3D ICs has been s...
239
Voted
PROCEDIA
2011
14 years 6 months ago
2011
Two decades of microprocessor architecture driven by quantitative 90/10 optimization has delivered an extraordinary 1000-fold improvement in microprocessor performance, enabled by...
168
Voted
JCDL
2011
ACM
14 years 6 months ago
2011
ACM
We need to harness the growing wealth of information in digital libraries to support intellectual work involving creative and exploratory processes. Prior research on hypertext au...