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CORR
2008
Springer
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CORR 2008
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0-level Vacuum Packaging RT Process for MEMS Resonators
15 years 4 months ago
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hal.archives-ouvertes.fr
A new Room Temperature (RT) 0-level vacuum package is demonstrated in this work, using amorphous silicon (aSi) as sacrificial layer and SiO2 as structural layer. The process is co...
Nicolas Abelé, D. Grogg, C. Hibert, F. Cass...
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