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ASPDAC
2005
ACM
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ASPDAC 2005
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Thermal-driven multilevel routing for 3-D ICs
15 years 8 months ago
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cadlab.cs.ucla.edu
3-D IC has a great potential for improving circuit performance and degree of integration. It is also an attractive platform for system-on-chip or system-in-package solutions. A cr...
Jason Cong, Yan Zhang
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