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128
Voted
DAC
2011
ACM
147
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Computer Architecture
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DAC 2011
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Non-uniform micro-channel design for stacked 3D-ICs
14 years 3 months ago
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ftp.eng.umd.edu
Micro-channel cooling shows great potential in removing high density heat in 3D circuits. The current micro-channel heat sink designs spread the entire surface to be cooled with m...
Bing Shi, Ankur Srivastava, Peng Wang
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