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129
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ASPDAC
2011
ACM
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ASPDAC 2011
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Vertical interconnects squeezing in symmetric 3D mesh Network-on-Chip
14 years 7 months ago
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Abstract— Three-dimensional (3D) integration and Networkon-Chip (NoC) are both proposed to tackle the on-chip interconnect scaling problems, and extensive research efforts have b...
Cheng Liu, Lei Zhang 0008, Yinhe Han, Xiaowei Li
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