127
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ISPD
2012
ACM
13 years 7 months ago
2012
ACM
In this paper, we propose a new approach for gated bus synthesis [16] with minimum wire capacitance per transaction in three-dimensional (3D) ICs. The 3D IC technology connects di...
ASPDAC
2012
ACM
13 years 7 months ago
2012
ACM
— Since re-designing and re-optimizing existing logic, memory, and IP blocks in a 3D fashion significantly increases design cost, nearterm three-dimensional integrated circuit (...
194
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ASPDAC
2012
ACM
13 years 7 months ago
2012
ACM
— The Dark Silicon Age kicked off with the transition to multicore and will be characterized by a wild chase for seemingly ever-more insane architectural designs. At the heart o...
95
Voted
ASPDAC
2012
ACM
13 years 7 months ago
2012
ACM
Abstract— Integrating optical interconnects into the nextgeneration multi-/many-core architecture has been considered a viable solution to addressing the limitations in throughpu...
ASPDAC
2012
ACM
13 years 7 months ago
2012
ACM
104
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ASPDAC
2012
ACM
13 years 7 months ago
2012
ACM
Behavioral synthesis tools have made significant progress in compiling high-level programs into register-transfer level (RTL) specifications. But manually rewriting code is still ...
90
Voted
ASPDAC
2012
ACM
13 years 7 months ago
2012
ACM
With technology scaling, integrated circuits behave more unpredictably due to process variation, environmental changes and aging effects. Various variation-aware and adaptive desi...
106
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ASPDAC
2012
ACM
13 years 7 months ago
2012
ACM
—There is great demand for an accurate and scalable metric to evaluate the functional stimuli, testbench checkers, and DfD (Design-for-Debug) structures used in post-silicon timi...
118
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ASPDAC
2012
ACM
13 years 7 months ago
2012
ACM
—In both pre-silicon and post-silicon validation, the detection of design errors requires both stimulus capable of activating the errors and checkers capable of detecting the beh...
ASPDAC
2012
ACM
13 years 7 months ago
2012
ACM
— In this paper, we present an obstacle-aware clock tree synthesis method for through-silicon-via (TSV)-based 3D ICs. A unique aspect of this problem lies in the fact that variou...