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109
Voted
ISLPED
2009
ACM
110
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Hardware
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ISLPED 2009
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SOI, interconnect, package, and mainboard thermal characterization
15 years 9 months ago
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masc.soe.ucsc.edu
This paper presents an evaluation to determine the importance of the accurate thermal characterization for several elements of a semiconductor device. Specifically, it evaluates ...
Joseph Nayfach-Battilana, Jose Renau
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