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126
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ISVLSI
2007
IEEE
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ISVLSI 2007
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Impact of Process Variations on Carbon Nanotube Bundle Interconnect for Future FPGA Architectures
15 years 9 months ago
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www.cse.psu.edu
As CMOS technology continues to scale, copper interconnect (CuI) will hinder the performance and reliability of Field Programmable Gate Arrays (FPGA) motivating the need for alter...
Soumya Eachempati, Narayanan Vijaykrishnan, Arthur...
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