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    IEEE
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    Exploring Carbon Nanotube Bundle Global Interconnects for Chip Multiprocessor Applications
    15 years 10 months ago
    Exploring Carbon Nanotube Bundle Global Interconnects for Chip Multiprocessor Applications
    Download  www.engr.colostate.edu
    The current paradigm of using Cu interconnects for on-chip global communication is rapidly becoming a serious performance bottleneck in ultra-deep submicron (UDSM) technologies. C...
    Sudeep Pasricha, Nikil Dutt, Fadi J. Kurdahi
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