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111
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DATE
2010
IEEE
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DATE 2010
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An RDL-configurable 3D memory tier to replace on-chip SRAM
15 years 7 months ago
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—In a conventional SoC designs, on-chip memories occupy more than the 50% of the total die area. 3D technology enables the distribution of logic and memories on separate stacked ...
Marco Facchini, Paul Marchal, Francky Catthoor, Wi...
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