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107
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CORR
2008
Springer
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CORR 2008
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Copper Electrodeposition for 3D Integration
15 years 3 months ago
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hal.archives-ouvertes.fr
Abstract-Two dimensional (2D) integration has been the traditional approach for IC integration. Increasing demands for providing electronic devices with superior performance and fu...
Rozalia Beica, Charles Sharbono, Tom Ritzdorf
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