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134
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ICRA
2000
IEEE
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Robotics
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ICRA 2000
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Application of a Model-Free Algorithm for the Packing of Irregular Shaped Objects in Semiconductor Manufacture
15 years 7 months ago
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robots.mit.edu
A Robotic System is being developed to automate the crucible packing process in the CZ semiconductor wafer production. It requires the delicate manipulation and packing of highly ...
Vivek A. Sujan, Steven Dubowsky
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