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100
Voted
DATE
2010
IEEE
142
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Hardware
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DATE 2010
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Testing TSV-based three-dimensional stacked ICs
15 years 8 months ago
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www.date-conference.com
To meet customer’s product-quality expectations, each individual IC needs to be tested for manufacturing defects incurred during its many high-precision, and hence defect-prone ...
Erik Jan Marinissen
claim paper
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